In addition to the launch of two new Tiger Lake refresh processors: Core i7-1195G7 and i5-1155G7, Intel also announced innovations with the Wi-Fi 6E solution and Intel 5G 5000 solution. This is Intel’s innovation to bring the 5G M.2 the first one. A solution created in partnership with MediaTek.
The new Intel 5G Solution 5000 includes a Fibocom module, MediaTek firmware and Intel Host software. Therefore, the subwoofer works with the modern frequency band of 6 GHz, offering a download speed of 4.7 Gbps and an upload speed of 1.25 Gbps over 5G NR.
Intel’s Continuing Innovation
Intel’s innovation and leadership with the 11th-generation Intel Core family and verified Intel® Evo-platform design continues with leading-edge storage and connectivity technologies that are critical to delivering amazing computing experiences.
Wi-Fi 6E is the most important update of consumer Wi-Fi in the last 20 years. Intel introduced the first Wi-Fi 6E solution in the PC market in early 2021. Selected new 11th generation Intel Core designs will continue to accelerate industry-leading usage with the best Intel Wi-Fi 6E (Gig +) products, enabling Gigabit + speeds. . , Shorter recovery time and improved reliability through unweighted Wi-Fi performance in new 6 GHz strips (where available).
Platform-based 11th-generation Intel Core processor, combined with second-generation Intel® Optane 20 memory, launched with solid-state storage (SSD), a high level for large media management, game files, and applications Accelerates everyday tasks with responsiveness and large storage. Quantity. SSDs with Intel Optane memory are the fastest, enabling launch applications such as Adobe Photoshop up to 49%.
Intel continues to advance computer experiences beyond pure performance. In conjunction with key platform technologies and system optimization, Intel Evo platform verified mobile designs are designed together to ensure exceptional response, long battery life, instant wake-up and impressive connectivity.
To date, there have been more than 85 major Intel Evo designs launched from major OEMs including Acer, ASUS, Dell, HP, Lenovo, MSI and Samsung, and Intel expects to see more than 100 from more than 15 manufacturers by the end of this year. More designs will be validated. The year. Intel has partnered with more than 150 ecosystem partners to create a deeper level of enhanced mobile computing, with plans to invest more than $ 50 million in Intel Evo Ecosystem Innovation this year.
Intel 5G Solution 5000
Intel has introduced its first 5G M.2 solution with global vendor certification. The Intel 5G Solution 5000 delivers a speed increase of almost five times compared to Intel® Gigabit Long-Term Evolution (LTE) from anywhere. Intel has partnered with MediaTek on product definition, development, certification and support for 5G modem solutions for next-generation computer experiences and Fibocom to provide 5G M.2 (FM350-GL) solutions.
Acer, ASUS and HP are among the first source manufacturers to be able to enable modern connected laptops this year with the help of the Intel 5G 5000 solution, based on 11th generation Intel® Core, U- and H processors. The pace continues with the expectation of more than 30 designs by 2022.
The combination of fast, 5G connectivity along with Intel Wi-Fi 6 / 6E (Gig +) provides a seamless experience across all network types. As Intel sets a new standard for mobile computing, Wi-Fi and 5G will be the main pillars supporting broad connectivity needs in the future.
The Intel 5G solution is based on two recently announced collaborations with 5000 partners in the ecosystem, China Mobile, HP and MediaTek and DoCoMo and HP to introduce a new generation of fully connected computers.
Intel 5G Solution 5000 Specification
Fibocom FM350-GL (Intel 5G Solution 5000) specifications:
- Modem technologies – 5G NR, 4G LTE, 3D WCDMA
- Frequency bands – Sub 6GHz for global coverage
- Data throughput
- 5G NR – Up to 4.7 Gbps downlink; up to 1.25 Gbps uplink
- 4G LTE – Up to 1.6 Gbps Cat 19downlink; up to 150 Mbps uplink
- Built-in eSIM
- Host interface – PCIe Gen 3
- Dimensions – 30 x 52 x2.3 mm (M.2 card)
- Temperature Range – -10 to +55°C